| Dealer and supplier of machineries such as Dispensing System, UV Curing Systems, UV Instruments, Surface Mount Technolgy System, Soldering Station, Robotic System, Adhesives and Epoxy from Malaysia, Singapore, Thailand, and China. |
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Solder Paste
Lead Free Solder Paste
ECOREL FREE SAC
- No Clean
- High first pass yield at ICT
- High printing speed
- Long stencil & abandon time
- Excellent wettability on different PCB finishing
- Most common alloys: SAC different Ag %, SnAg
- Powder sizes: 20 – 45 microns (T3 & T4)
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Packaging Type
- 500 gr Jar
- 600 gr cartridge
- Fine Pitch
- High Printing Speed
- Long Stencil Life/ abandon time
- IPC recommended lead free alloy
- Clean Standard alloys
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SOLDER PASTE containing Lead
No- Clean Standard alloys
Sn63Pb37
Sn62Pb36Ag2
- Fine Pitch
- High Printing Speed
- Long Stencil Life/ abandon time
- Open/ Close head printing
- Dot dispensing
- Used in Automotive applications
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Packaging Type
500 gr Jar
- 700 gr cartridge
- 1,400 gr cartridge
- 800 gr proflow cassette
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Low Residue / No Clean fluxes
- High Fist Pass Yield
- Nitrogen Atmospeheres
- Applied by Foam or Spray
- 10, 20 and 200 Lt plastic bidon
- Developed for LEAD FREE processes
- Excellent wettability
- Used in Automotive Applications
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